SRX10-014B-P7

As a professional manufacturer specializing in the R&D and production of profile heat sinks, our independently developed SRX10-014B-P7 heat sink is tailor-made for the heat dissipation needs of high-power electronic components, with a core positioning as a Custom Extruded Profile Heat Sink. The core parameters of the product, such as profile structure and installation dimensions, can be customized and precisely adjusted according to the core needs of customers' equipment specifications and heat generation power, ensuring accurate matching with the heat dissipation system layout requirements in different application scenarios.

First and foremost, this SRX10-014B-P7 product is a High Thermal Conductivity Extruded Heat Sink: We adopt high-performance 6063-T5 aluminum alloy as the base material, whose thermal conductivity is ≥201W/(m·K), far exceeding that of ordinary aluminum alloy profiles. The extrusion molding process not only ensures the uniformity of the material but also significantly reduces the thermal resistance of the heat conduction path. Even when facing concentrated heat-generating components with 10-25W power, it can quickly conduct core heat to the fin surface, laying a solid foundation for subsequent heat exchange.

Meanwhile, it is also a CNC Machined Extruded Heat Sink: After the profile extrusion molding, we complete the processing of mounting holes, positioning grooves and other details through high-precision CNC machining, with the processing accuracy controlled within ±0.05mm, ensuring that the fit degree between the heat sink and electronic components, equipment shell reaches more than 98% — this process effectively avoids contact thermal resistance caused by installation gaps, increasing heat dissipation efficiency by about 15%.

The fin height of SRX10-014B-P7 is 14mm, and the fin spacing is optimized to 2.2mm, expanding the heat dissipation area to 6 times that of the base material surface area in a limited space. Practical tests show that in a normal temperature environment of 25℃, when matched with a micro fan of 500 rpm, the temperature rise of 15W power components can be controlled within 28℃, fully meeting the heat dissipation requirements of communication equipment, routers and other devices.

The core application scenarios of the SRX10-014B-P7 heat sink focus on network communication terminal equipment such as optical modems and routers. Aiming at the heat dissipation needs of optical modem main control units and router core chips, its compact structural design can perfectly adapt to the narrow installation space inside the equipment. The combination of 14mm fin height and 2.2mm optimized spacing can efficiently conduct heat generated by the chip during operation in a limited space. At the same time, the customized installation dimensions and the fit degree guaranteed by high-precision CNC machining can accurately match the assembly needs of different models of optical modems and routers, effectively avoiding heat dissipation failure caused by installation gaps, ensuring the temperature stability of the equipment during long-term high-load data transmission, and improving the reliability and stability of network operation.